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The production process of the infrared receiver

2023-05-2436

Infrared Receiver Module (IRM) is a type of OPIC (Optical IC), which is a combination of optoelectronic components and integrated circuits (ICs). It is an IC-based infrared light-receiving device that combines a photodiode and a special instruction set integrated circuit (ASIC) to simplify and miniaturize the circuit design of products for applications.

Dongyi's IC PD generation process is made of pure gold wire, which has high quality and high reliability. We have adopted an automatic and machine-oriented production method and applied a paperless management system, which makes the entire factory digital and intelligent. Our overall process includes die bonding, potting testing, and spectroscopic processing. In the die bonding process, we use copper alloy brackets to hold the IC PD to ensure its high quality and reliability. In addition, we also use silver glue as a material because it is one of the most commonly used materials in IC processing components. The main function of this process is to secure the IC PD to the bracket through DIE BOND, and realize its high quality and reliability in the manufacturing process. Eventually, we receive the light signal with the PD's photodiode. Among them, DIE BOND is to fix the chip (IC PD) to the bracket. The materials used in this process are IC, PD, bracket, silver glue, IC is the processing element of the receiving head, mainly composed of silicon crystal and circuit, is a highly integrated device, the main functions are filtering, shaping, decoding, amplification and other functions. PD is a photosensitive diode, and its main function is to receive optical signals.

The bracket is the pin part of the receiving head, which is used to connect the functional pins of the IC and the external connection to realize functions such as fixing the chip. The main components of silver glue are silver powder and epoxy resin, which are used through conductivity and fixing properties.

Silver glue, belongs to high temperature curing silver glue, the theoretical curing temperature is 170 degrees for 1 hour, due to the consideration of the factor of the stent, now the curing conditions of 150 degrees for 2 hours are implemented.

There are two types of brackets, shielded and unstrapped

The wire bonding process, also known as WIRE BOND, is to connect the IC and PD function points with gold wires, and this process mainly involves gold wires. The quality of this process is directly related to the quality of the finished product and the stability of the product.

Finally, there is the introduction to packaging

The packaging process is a fixed shape, and Dongyi has two packaging shapes, one is the glue filling nose bridge type, and the other is the glue filling spherical shape. This process is the key to the formation of the product, and once packaged, it is not allowed to be reworked, so the solid soldering process should be strictly inspected before packaging.

The main materials used are liquid epoxy resin, solid epoxy resin, 04 pigment, 08 pigment, etc.

The filter range of pigment 04 is 830-1050, the filter range of 08 pigment is 750-1150, the wider the range, the better the receiving sensitivity of the receiving head, but the worse the anti-interference, the narrower the filter range, the better the anti-interference, but the receiving effect will be slightly worse, in order to meet the needs of different customers, the two pigments are matched in different proportions to meet customer requirements.

     

Post-processing

There are mainly shelling, welding, punching, testing, two cutting, packaging and other links, except for shelling is according to customer requirements, others must be completed. The current test is only a simple test of the receiving distance, and other parameters are not tested, which is risky and is being improved. The high-risk process is the punching process, so remember to check and work according to the work instructions. The molds involved in this process are simple punching dies, focusing on the tolerance range of the molds.

The main materials involved are iron shell, the raw material of the iron shell is 0.3mm tinplate, which does not need electroplating, but the bare storage time is relatively short, generally not more than 1 month, in addition to the ordinary 0.3mm iron, which needs to be tinned, the storage time of this process is very long and will not rust, considering the cost factor, the ordinary iron shell is made of tinplate.


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